Thermal paste GEMBIRD TG-G3.0-01
95 ₴
GEMBIRD ETG-G3.0-01 thermal paste is a heat-conducting mass in a high-viscosity syringe, which is used to improve thermal conductivity between heat-dissipating elements of electronic circuits and a radiator. It is applied in a thin layer between the chip and the radiator. It is designed to fill all microcracks, as well as scratches and metal deformations, to ensure maximum heat transfer between the core and the radiator of the cooler. Thermal paste does not crumble, does not leak, is electrically non-conductive.
Characteristics of Thermopaste
- Manufacturer
- GEMBIRD
- Working temperature
- от -45 до 240°C
- weight
- 3 г
- Article
- TG-G3.0-01
- compatibility
- для процессоров
- Thermal conductivity
- 4.5 Вт/мК
- Model
- TG-G3.0-01
- Viscosity
- 76 сП
- Country of manufacture
- Китай
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