Thermal paste GEMBIRD ETG-G3.0-01 is a heat-conducting mass in a high-viscosity syringe, which is used to improve thermal conductivity between heat-dissipating elements of electronic circuits and a radiator. It is applied in a thin layer between the chip and the radiator. It is designed to fill all microcracks, as well as scratches and metal deformations, to ensure maximum heat transfer between the core and the radiator of the cooler. Thermal paste does not crumble, does not leak, is electrically non-conductive.
Characteristics
- Compatibility
- для процесорів
- Manufacturer
- Gembird
- Thermal conductivity
- 4.5 Вт/мК
- Viscosity
- 76 сП
- Working temperature
- від -45 до 240° C
- weight
- 3 г
- Country of manufacture
- Китай
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