Thermal paste GEMBIRD TG-G1.5-01 is a heat-resistant mass of high viscosity, which is used to improve thermal conductivity between heat-emitting elements of electronic circuits and a radiator. Thermal paste is applied in a thin layer between the chip and the radiator. It is designed to fill all microcracks, as well as scratches and metal deformations, to ensure maximum heat transfer between the core and the radiator of the cooler.
Characteristics
- Compatibility
- для процесорів
- Manufacturer
- Gembird
- Thermal conductivity
- 4.5 Вт/мК
- Viscosity
- 76 сП
- Working temperature
- від -45 до 240° C
- weight
- 1.5 г
- Country of manufacture
- Китай
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